Cambridge, UK – For optimal temperature control in rotational molding processes, Datapaq now provides the RotoPaq system which can collect data directly from inside the oven, mold surface, and even within the mold. The data logger, thermal barrier, and thermocouples are attached to the rotating mold assembly to record temperature data throughout the continuous heating and cooling cycles. In addition to being stored in the logger, the data can be transmitted in real time using radio telemetry. The temperature profile enables users to control and optimize the process in order to avoid common manufacturing defects such as warping, pinholes/bubbles, discoloration, and uneven impact resistance, thus ensuring both high product quality and efficiency. The RotoPaq system is routinely used to validate new materials and processes or when environmental conditions change. Its excellent thermal protection allows continuous operation for up to 14 hours. Datapaq also provides thermal barriers for use in water shower cooling. The Insight analysis software enables quality control certification for customers or according to industry standards such as QS9000.

Cambridge, UK – Datapaq has customized a temperature profiling solution for vapor phase soldering for an electronics supplier to the automotive, aerospace, military, and medical industries. The comeback of vapor phase soldering (or condensation reflow) as an efficient technology for small batches of high-value electronic assemblies calls for state-of-the-art quality assurance measures without the drawback of trailing sensor cables. Accordingly, the DQ1862 data logger and the corresponding thermal barrier have been developed for inline application. Both being extra small, they can simply be placed inside the carrier tray along with SMD packages. The logger records a detailed temperature profile of the complete pre-heat and vapor soldering process. The accompanying Insight software provides for in-depth analysis and clear visualization. The system is used to compare the performance of different machines and ensure that all are optimized, contributing to minimal reject rates. Without trailing thermocouple cables, profiling is now conducted safely, quickly, and easily. Based on the Datapaq solution the customer has reduced setup times considerably.

Cambridge, UK – Extending the Oven Tracker XL2 system, Datapaq introduces the new and improved MicroMag thermocouple designed for use in automotive paint monitoring. Working extensively with key automotive paint operations worldwide, Datapaq has further extended the operating capability of the popular MicroMag thermocouple. The new encapsulated magnet design allows reliable direct use during production, even on wet painted and e-coated substrates. It eliminates any risk of either magnet damage or magnet loss when the probe is removed from a cured paint surface at the end of the oven process. The miniature surface and air thermocouple which employs state-of-the-art samarium-cobalt magnet technology can be placed into the tightest of recesses. It is therefore ideal for car body shell areas that are difficult to access. Due to its low thermal mass, the MicroMag provides response characteristics that challenge those of exposed junction thermocouples while it has the additional advantage of quick and easy attachment to ferrous substrates. Despite its compact size, 17 mm in diameter, the magnet ensures secure hold up to the maximum experienced paint and powder coating cure temperatures. An aluminum knob for easy routine rugged handling, even when wearing gloves, can be removed, if necessary, to suit application requirements.

Cambridge, UK – Datapaq provides the first ever temperature profiling system specifically for glass tempering processes. It uses thermocouples to take measurements from the glass sheet while passing through the tempering furnace. The Furnace Tracker system for glass tempering furnaces accurately measures temperatures from all types of glass including hard and soft-coated low-E glass. Thus, users can optimize cycle times and reduce energy costs. The system includes a choice of fast-response type-K thermocouples that can be cemented to the glass sheet under test. Up to four thermocouples are attached to a DQ1840 data logger which records detailed temperature profiles. The logger is protected from the heat of the furnace by a low-height thermal barrier designed especially for glass tempering furnaces. The TB7528 thermal barrier measures a mere 29 mm in height with a 430 x 220 mm footprint.

Cambridge, UK – Working with a tier 1 electronics supplier to the automotive industry, Datapaq has tailored a temperature monitoring solution for documenting the repeatability of selective soldering processes. This development has become necessary as automotive manufacturers are increasingly requiring their suppliers to perform statistical process control. The economic argument for immediate quality control is strong, too: since margins are small in this industry segment, and the costs of product failures are high, measuring and controlling each process ensures profitability. Datapaq’s low-cost solution monitors both the pre-heat stage and the dip soldering stage and generates detailed temperature profiles that enable users to compare the performance of different machines, adjust parameters if necessary, and reduce setup time for new batches. Crucially, the system is small and light enough to pass through the process along with the printed circuit boards. It consists of a Q18 data logger and a PA2200A fixture holding two thermocouples for the pre-heat stage and three thermocouples for the dip soldering stage. The dip soldering probes enable the monitoring of solder temperature as well as dwell time in the solder (contact time). They can be adjusted to allow for measurement of contact time at different heights. The customer uses Datapaq products to monitor all soldering processes. In addition to minimizing training costs, this facilitates the establishment of best practices since central process development engineers can compare measurements from all their assembly facilities.

Cambridge, UK – Datapaq presents temperature measurement systems for the electronics industry at the SMT Hybrid Packaging 2013 exhibition in Nuremberg, Germany, in Hall 7, at Stand 513. Reflow Tracker systems are used in reflow soldering processes as well as in wave, vapor phase, and selective soldering, and at rework stations. They help reduce reject rates and increase yield. Melting the solder with optimal energy consumption but without damaging the electrical components requires precise temperature control. The systems pass through SMT processes along with the printed circuit boards, providing data for real-time monitoring via radio, if required. Temperature profiles from up to twelve thermocouples per data logger can be displayed and analyzed with the accompanying software. User-friendly tools support analysis, oven setup, and the determination of the optimal oven recipe for simple as well as complex components.

Cambridge, UK – DATAPAQ, a leading provider of temperature measurement and analysis systems for all types of industrial heating processes, introduces the 7.20 version of its Insight software. Responding to customer feedback, the new release adds many features and enhancements that make the profiling of thermal processes easier and more efficient. These include a larger palette of colors for probes and the graph background and a color selection feature that enables users to better distinguish overlay probes on the graph. Moreover, the graph options in all full Insight software versions now allow the numeric zone set temperature values to be displayed on the graph. Further changes include, amongst others, a Contour Plot function for the Insight Solar and Insight Reflow versions, a new virtual probe to show the difference between the hottest and the coolest thermocouple, and product manuals that are now included as PDFs on the Insight DVD.

Cambridge, UK – At the European Coatings Show 2013 in Nuremberg, Germany (Hall 5, Stand 127), Datapaq presents temperature monitoring solutions for industrial coating processes. Specially tailored to paint drying and curing in the automotive industry, the Oven Tracker XL2 system is one of the prime exhibits. The heavy-duty system also caters to high-temperature coating applications up to more than 300 °C, oven manufacturers, and other sectors. Directly upon leaving the oven, green and red LEDs signal whether preprogrammed process criteria have been met. Thereby, any problem can be identified early on. The data logger does not have to be connected to a computer for data readout after every profiling run but performs up to ten consecutive runs.

Thermal barriers for sustained high-temperature operation